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4 inch GaAs Wafer

Specific Information
The GaAs wafer can be utilized for manufacturing various semiconductor devices, including high-frequency, microwave, and optoelectronic devices. GaAs chips are typically employed as substrates for high-performance electronic and optoelectronic devices such as high-speed RF and microwave power amplifiers, laser diodes, and optoelectronic conversion devices. Its excellent electrical properties and higher mobility make it widely applicable in fields like communication, radar, wireless networks, and optical communication.
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  • specification
  • Properties
  •                               
     
    Item Gallium Arsenide Substrate(2~6inch )
    Diameter 50.8±0.3mm 76.2±0.3mm 100.0±0.3mm 150.0±0.5mm
    Thickness 350±25μm 350±25μm 350±25μm 675±25μm
    Surface Orientation (100) 15.0˚± 1.0˚ off toward (111) <100>±1.0°
    Primary Flat Orientation EJ<0-1-1>±1.0°
    Primary Flat Length 12.0±1.5mm 22.0±2.0mm 32.0±2.0mm Notch
    Secondary Flat Orientation EJ<0-1 1>±1.0° N/A
    Secondary Flat Length 7.0±1.5mm 12.0±2.0mm 18.0±2.0mm N/A
    Front Surface Finish Epi-polished
    Back Surface Finish SSP:Etched; DSP:Epi-polished
    Laser Mark Back side
    TTV ≤10μm ≤10μm ≤15μm ≤20μm
    BOW ≤12μm ≤15μm ≤20μm ≤25μm
    WARP ≤15μm ≤20μm ≤25μm ≤30μm
    Edge Exclusion ≤3mm
    Application Conductivity for LED Conductivity for LD Semi-insulating for microelectronics
    Conduction Type N-Type N-Type Insulating
    Dopant Si-doping Si-doping Undoped
    Resistivity (1~9)E-3Ω·cm (1~9)E-3Ω·cm >1E7Ω·cm
    Etch Pit Density(EPD) <5000/cm2 <500/cm2 <5000/cm2
    Carrier Concentration (0.4~4)E18/cm3 (0.4~2.5)E18/cm3 N/A
    Mobility >1000cm2/v.s 1500~3000cm2/v.s >4000cm2/v.s

     

    Customization specifications:

    * Various sizes and shapes such as 10*10mm.

    * Various types:like P-Type(Zn-doped)

    * Various orientations such as(111),(110),Off-Axis:2°/6°/10°.

    * Various surface roughness such as slicing,lapping.

    * GaAs crystal ingots are available.
     

  • Gallium arsenide(GaAs) is an inorganic compound,which is a zinc blende crystal structure, and a black-gray solid with a melting point of1238°C. It is stably below 600°C and is not corroded by non-oxidizing acids. Compared with single crystal silicon(Si), it belongs to the second generation of semiconductor materials and also is a III-V direct band gap semiconductor.

     

    Gallium arsenide(GaAs) has a direct band gap, higher electron mobility, high-frequency low-noise, and high conversion efficiency and other advantages in comparison to silicon(Si).

     

    Crystal Structure Cubic
    Lattice Constant(nm) a=5.6534 Å  
    Density(g/cm3) 5.316
    Melting point(℃) 1238
    Mohs Hardness(mohs) 5.6
    Dielectric Constant 13.1
    Band Gap(eV) 1.424
    Breakdown Electrical Field (MV/cm) 3.3

    Thermal Conductivity(W/cm.K)

    0.55
    Thermal Expansion  5.8*10-6/k
    Refractive Index  3.24-3.33

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